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Two-dimensional array transducers using thick film connection technology.

S W Smith¹, E D Light

¹Dept. of Biomed. Eng., Duke Univ., Durham, NC.

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control

|January 1, 1993

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A novel multi-layer ceramic (MLC) connector speeds up ultrasound transducer fabrication. This thick-film technology improves performance and reduces crosstalk for 2D array transducers.

Area of Science:

Materials Science
Electrical Engineering
Biomedical Engineering

Background:

Traditional fabrication of 2D array ultrasound transducers is time-consuming.
Interconnects in ultrasound arrays are critical for signal integrity and performance.

Purpose of the Study:

To develop a faster fabrication method for 2D array ultrasound transducers.
To evaluate the performance of a novel multi-layer ceramic (MLC) connector.

Main Methods:

Utilized thick-film microelectronic technology to create a multi-layer ceramic (MLC) connector.
Integrated a conductive lambda/4 mismatching layer and customized interconnections (vias).
Configured a 16x16 transducer array with a 0.6 mm element spacing, expanded to a 16x16 grid of connector pins.

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Main Results:

The MLC connector enables faster transducer array fabrication, independent of element count.
Achieved good agreement in vector impedance, sensitivity, bandwidth, interelement uniformity, and crosstalk compared to conventional methods.
Reduced electrical crosstalk by interleaving ground and signal layers.

Conclusions:

The developed MLC connector offers a significant improvement in fabrication speed for 2D array ultrasound transducers.
This thick-film approach maintains or improves upon the performance characteristics of conventionally fabricated arrays.
The technique is scalable and suitable for advanced ultrasound imaging applications.