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Plastic modules for free-space optical interconnects.

D T Neilson, E Schenfeld

    Applied Optics
    |February 15, 2008
    PubMed
    Summary
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    A novel snap-together packaging technique combines optoelectronic and optomechanical components for free-space optical interconnects. This method simplifies assembly by integrating relaying and routing functions into molded plastic modules, eliminating the need for further alignment.

    Area of Science:

    • Optoelectronics
    • Optomechanics
    • Optical Engineering

    Background:

    • Traditional optical interconnects often require complex alignment procedures.
    • Integrating optoelectronic components with optical systems presents packaging challenges.

    Purpose of the Study:

    • To present a combined optoelectronic and optomechanical packaging technique for snap-together free-space optical interconnect systems.
    • To demonstrate the integration of optoelectronic chips with molded plastic optical modules.

    Main Methods:

    • Development of snap-together modules using transparent optical molded plastic.
    • Integration of relaying and routing functions within the plastic modules.
    • Methods for integrating vertical-cavity surface-emitting laser (VCSEL) and receiver arrays, and other chips into optoelectronic multichip modules.

    Related Experiment Videos

  • Design considerations for coupling to and from optical fiber arrays.

    • Main Results:

    • The molded plastic modules achieve sufficient alignment precision, negating the need for post-assembly adjustments.
    • Successful integration of optoelectronic chips, including VCSEL and receiver arrays.
    • Demonstrated capability for coupling to optical fiber arrays.
    • A test-bed system was assembled using conventional machining techniques to validate the concept.

    Conclusions:

    • The described packaging technique offers a simplified and precise method for constructing free-space optical interconnect systems.
    • The integrated modules facilitate the creation of optoelectronic multichip modules with potential for fiber optic integration.
    • This approach reduces assembly complexity and alignment requirements in optical interconnect systems.