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Related Experiment Video

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Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices

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Published on: January 17, 2017

Indirect bonding--a new transfer method.

B Wendl¹, H Droschl, P Muchitsch

¹Department of Orthodontics and Dentofacial Orthopedics, University of Graz, Austria. dr.b.wendl@tele2.at

European Journal of Orthodontics

|February 16, 2008

Summary

This summary is machine-generated.

The Aptus Bonding Device (ABD) effectively transfers orthodontic brackets with high accuracy, matching the shear bond strength (SBS) of direct bonding. This method ensures clinically acceptable bond strength without compromising placement precision.

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Area of Science:

Orthodontics
Dental Materials Science
Biomaterials

Background:

Indirect bonding offers potential advantages in orthodontic bracket placement.
Assessing the accuracy and bond strength of indirect bonding systems is crucial for clinical application.

Purpose of the Study:

To evaluate the shear bond strength (SBS) of indirectly bonded brackets using the Aptus Bonding Device (ABD).
To assess the accuracy of bracket positioning with the ABD compared to direct bonding.
To compare the SBS of indirect and direct bonding methods.

Main Methods:

In vitro shear testing of indirectly and directly bonded brackets.
Three-dimensional (3D) laser scanning and photographic superimposition for assessing bracket positioning accuracy.
Statistical analysis using ANOVA and Tukey-HSD tests (P < 0.05).

Main Results:

No significant difference in SBS between indirect bonding with ABD and direct bonding.
The ABD demonstrated high accuracy in bracket placement, with minimal deviations (X-axis: 0.15 mm, Y-axis: 0.17 mm, Z-axis: 0.19 mm).
All tested groups achieved the clinically required minimum bond strength of 6 MPa.

Conclusions:

The Aptus Bonding Device (ABD) is a reliable tool for indirect orthodontic bracket bonding.
The ABD does not compromise bond strength and ensures precise bracket placement.
Indirect bonding with the ABD is a viable alternative to direct bonding.