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Updated: Jul 7, 2026
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A Stable Phantom Material for Optical and Acoustic Imaging
Published on: June 16, 2023
Measurement of a damaged layer thickness with reflection acoustic microscope
I Ishikawa1, H Kanda, K Katakura
1Hitachi Constr. Machinery Co. Ltd., Tokyo.
Summary
This study used acoustic microscopy to measure surface acoustic wave (SAW) velocity in machined silicon. This method accurately estimates the thickness of damaged layers on silicon single-crystal surfaces.
Area of Science:
- Materials Science
- Acoustics
- Surface Engineering
Background:
- Machining silicon single-crystal surfaces can introduce subsurface damage.
- Characterizing the depth and distribution of this damage is crucial for material performance.
Purpose of the Study:
- To determine the frequency dependence of surface acoustic wave (SAW) velocity.
- To develop a method for estimating the thickness of machined-induced damaged layers in silicon.
Main Methods:
- Utilized an acoustic microscope to measure SAW velocity on machined silicon specimens.
- Analyzed the frequency dispersion curves of SAW velocity to identify curvature points.
- Correlated curvature points with the wavelength of SAWs to estimate layer thickness.
Main Results:
- Thickness of damaged layers was estimated from curvature points on SAW velocity dispersion curves.
- Layer thickness estimation is approximately half the wavelength at the curvature frequency.
- Distinguished and measured thicknesses of multiple damaged layers (top and inner) using distinct curvature points.
Conclusions:
- Acoustic microscopy provides a viable method for non-destructively characterizing subsurface damage in machined silicon.
- The frequency dispersion of SAW velocity is sensitive to the depth and extent of surface damage.
- This technique allows for depth-resolved imaging and analysis of damage distribution.
