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Evaluating Plasmonic Transport in Current-carrying Silver Nanowires
Published on: December 11, 2013
Facile fabrication of silver nanofin array via electroless plating
Kentaro Miyoshi1, Yoshitaka Aoki, Toyoki Kunitake
1Innovative Nanopatterning Research Laboratory and Topochemical Design Laboratory, Frontier Research System, RIKEN, 2-1 Hirosawa, Wako, Saitama, Japan.
Langmuir : the ACS Journal of Surfaces and Colloids
|March 4, 2008
Summary
Researchers developed a new method for creating high-aspect-ratio silver nanofins using microlithography and plating. This technique enables rapid, shape-controllable fabrication of metallic nanostructures with electrical conductivity.
Area of Science:
- Nanotechnology
- Materials Science
- Electrical Engineering
Background:
- Fabricating metallic nanostructures presents significant challenges in nanotechnology.
- Developing efficient and controllable methods for creating nanostructures is crucial for advanced applications.
Purpose of the Study:
- To describe a novel fabrication process for silver nanofin arrays.
- To demonstrate the creation of high-aspect-ratio silver nanostructures with controlled dimensions.
Main Methods:
- The study combined microlithography, electroless plating, and etching techniques.
- Fabrication involved controlled electroless plating periods and line pattern heights.
Main Results:
- Successfully fabricated silver nanofins with a high aspect ratio (height/width = 10).
- Achieved controlled nanofin dimensions (width = 60 nm, height = 600 nm).
- Demonstrated metallic electrical conductivity in isolated silver nanofins.
Conclusions:
- The described process offers a rapid and shape-designable method for fabricating metallic nanostructures.
- This technique is promising for the scalable production of silver nanofin arrays.

