Morphology and electrochemical behavior of Ag-Cu nanoparticle-doped amalgams

Kwok-Hung Chung1, Li-Yin Hsiao, Yu-Sheng Lin

  • 1Division of Dental Materials Science, Department of Restorative Dentistry, University of Washington, Seattle, WA, USA.

Acta Biomaterialia
|March 7, 2008
PubMed

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