Scalability analysis of diffractive optical element-based free-space photonic circuits for interoptoelectronic chip...

Area of Science:

• Photonics
• Optical Engineering
• Materials Science

Background:

• Silicon integrated circuits face pin-input-output bottlenecks.
• Existing interconnection methods limit scalability and performance.

Purpose of the Study:

• Investigate an interchip free-space optical interconnection module.
• Analyze the scalability and performance of photonic circuits for chip-to-chip communication.

Main Methods:

• Theoretical analysis of photonic circuit scalability based on diffractive element feature size.
• Fabrication and testing of a prototype module.
• Measurement of insertion losses and polarization-dependent losses.

Main Results:

• Achieved interconnection densities of 1000-2000 channels/cm for a 40-mm interconnection length.
• Demonstrated diffraction-limited imaging capability with a fabricated prototype.
• Identified primary loss sources: binary linear gratings causing -23.4 dB (TE) and -25.9 dB (TM) insertion losses.

Conclusions:

• The free-space optical interconnection module is applicable for interchip connections.
• Design modifications can reduce insertion loss and improve tolerance.
• Further research can optimize performance for high-density optical interconnects.