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Updated: Jul 6, 2026

Comparative Study of Simulation of Temperature Rise in Ring Main Unit
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Comparative Study of Simulation of Temperature Rise in Ring Main Unit

Published on: July 5, 2024

A facility for characterizing the steady-state and dynamic thermal performance of microelectromechanical system

J H Cho1, C D Richards, R F Richards

  • 1Department of Chemical and Biomolecular Engineering, Johns Hopkins University, 3400 N. Charles Street, 221 Maryland Hall, Baltimore, Maryland 21218, USA. itrustyou@gmail.com

The Review of Scientific Instruments
|April 2, 2008
PubMed

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