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Updated: May 4, 2026

Characterization of Surface Modifications by White Light Interferometry: Applications in Ion Sputtering, Laser Ablation, and Tribology Experiments

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Subsurface damage distribution in the lapping process.

Zhuo Wang¹, Yulie Wu, Yifan Dai

¹College of Mechatronic Engineering and Automation, National University of Defense Technology, Changsha, Hunan, China. wangzhuo0305@yahoo.com.cn

|April 3, 2008

Summary

This summary is machine-generated.

This study reveals how lapping parameters affect subsurface damage (SSD) depth in optical lapping. Optimizing these parameters enhances material removal rate and reduces SSD for improved lapping efficiency.

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Area of Science:

Materials Science
Optical Engineering
Manufacturing Processes

Background:

Subsurface damage (SSD) is a critical factor affecting the performance and reliability of optical components.
Understanding the influence of lapping parameters on SSD is essential for precision manufacturing.

Purpose of the Study:

To systematically investigate the impact of lapping parameters on subsurface damage (SSD) depth.
To comprehensively characterize the features of SSD generated during optical lapping.
To propose an optimized lapping procedure for improved efficiency.

Main Methods:

Magnetorheological finishing wedge technique was employed to measure SSD depth and distribution.
Analysis of adjacent indentation interactions to interpret SSD generation.
Evaluation of material removal rate and SSD depth in relation to lapping parameters.

Main Results:

The study quantified the maximum depth and distribution of SSD under various lapping conditions.
A model for SSD generation was developed based on indentation interactions.
Key lapping parameters influencing material removal rate and SSD depth were identified.

Conclusions:

Lapping parameters significantly influence subsurface damage depth and material removal rate.
An optimized lapping procedure can be developed by controlling these parameters.
The findings contribute to enhancing efficiency and quality in optical lapping processes.