A new advanced experimental setup for in-depth study of the interfacial reaction during reactive wetting

Reactive wetting plays a crucial role in many technical processes, from soldering in microelectronics, production of metal/ceramic composites, to hot dip galvanizing in mass production of zinc coated steel sheet. In all these cases the wetting behavior of metal melts on different surfaces plays a crucial role in material joining and coating. In all these processes the formation of the interfacial reaction layer has to occur within as short a time as possible in order to ensure a fast overall production speed. As the interfacial layer determines the stability of the formed composites, detailed knowledge of its growth mechanisms is required for a directed process optimization. However, the investigation of the processes occurring at the buried interface between substrate and wetting phase is difficult, especially for the case of liquid metal wetting metallic or ceramic solid substrates at high temperatures. Here, a novel advanced technique for the investigation of high temperature wetting processes up to a temperature of 1100 K is presented. It is based on the sessile drop technique but, in addition, allows spinning off the droplet at any chosen wetting time, thus providing direct access to the interfacial reaction layer. Since the experimental setup is integrated into a UHV compatible reaction chamber, not only excellent control of the composition of the atmosphere is ensured, but also direct transfer to surface analytical tools such as scanning electron microscope or electron spectroscopy for chemical analysis without intermediate exposure to air is realized. As will be shown for the case of hot dip galvanising of steel, this is an outstanding advance compared to existing methods.