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Longwave plasmonics on doped silicon and silicides
Richard Soref1, Robert E Peale, Walter Buchwald
1Sensors Directorate, Air Force Research Laboratory, AFRL/RYHC, Hanscom Air Force Base, MA 01731-2909, USA. Richard.Soref@hanscom.af.mil
Optics Express
|June 12, 2008
Summary
Two novel plasmonic materials, ion-implanted silicon and thin-layer silicides, enable plasmo-electronic integrated circuits. These materials support low-loss surface plasmon polariton propagation on silicon chips for advanced optical applications.
Area of Science:
- Materials Science
- Nanotechnology
- Photonics
Background:
- Plasmo-electronic integrated circuits require novel materials for efficient signal propagation.
- Silicon photonics is a key area for developing integrated optical devices.
- Surface plasmon polaritons (SPPs) offer potential for miniaturized optical components.
Purpose of the Study:
- To propose and model two new plasmonic materials for silicon-based integrated circuits.
- To investigate the propagation characteristics of surface plasmon polaritons (SPPs) on these novel materials.
- To determine the feasibility of using these materials for plasmo-electronic devices.
Main Methods:
- Theoretical modeling and dispersion calculations were performed.
- The optical properties of ion-implanted silicon and thin-layer silicides on silicon were analyzed.
- Propagation lengths and wavelength ranges for SPPs were computed.
Main Results:
- Ion-implanted silicon (n-type or p-type) supports low-loss SPP propagation from 10 to 55 microm (10^20 cm^-3) and 2.8 to 15 microm (10^21 cm^-3).
- Thin-layer silicides (Pd2Si, NiSi, PtSi, WSi2, CoSi2) on silicon enable SPP propagation in the 0.5 to 7.5 microm range with propagation lengths up to 2300 microm.
- SPP mode fields predominantly extend into the air above the plasmonic waveguides.
Conclusions:
- The proposed ion-implanted silicon and silicide materials are promising for realizing plasmo-electronic integrated circuits on silicon chips.
- These materials offer versatile wavelength operation for various integrated photonic applications.
- The findings pave the way for advanced silicon-based optical and electronic device integration.

