Nondestructive method for reconnecting aluminum metallization on integrated circuits
1Raytheon Company, Equipment Development Laboratories, Sudbury, Massachusetts 01776, USA.
The Review of Scientific Instruments
|July 1, 1979
Abstract:
A failure analysis technique for reconnecting aluminum metallization on planar IC devices is described. The technique, utilizing a conductive paint deposited on the device surface, is nondestructive and easily removable.


