Area ratio effects on metal ion release from amalgam in contact with gold

The effect of area ratio, chloride concentration and brushing on amalgam in contact with gold was studied by measuring the amounts of elements released in the electrolyte. A type III gold alloy was stored for 4 months in contact with a conventional amalgam, area relations 6/1 and 6/3, in an electrolyte containing 85 mM NaCl with 10 mM phosphate buffer. A specimen with area relation 6/1 was also stored in a 10 mM NaCl solution with 10 mM phosphate buffer. The solutions were renewed each month and analyzed for Cu, Zn, Sn, Hg, and Ag in an atomic absorption spectrophotometer. Cross-sections of the amalgams were studied in a scanning electron microscope. The tendency for Sn and Cu to be released from the amalgam was greater than for the other elements. The Sn-release probably mainly originated from surface corrosion and Cu-release from subsurface corrosion. A stronger galvanic influence enhanced only the release of Cu, and to a less extent Zn. The subsurface corrosion of the amalgam and increasing release of Cu was, in contrast to the other elements, largely dependent on a high chloride concentration in the electrolyte. Light brushing of the specimens had no effect on the amounts of elements released.