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Updated: Jun 28, 2026

Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Published on: July 3, 2020
Study of the infrared spectral features of an epoxy curing mechanism
Liang Li1, Qili Wu, Shanjun Li
1The Key Laboratory of Molecular Engineering of Polymers, Ministry of Education, Department of Macromolecular Science, Fudan University, Shanghai, 200433, China.
Abstract:
In this work, the isothermal curing process of diglycidyl ether of bisphenol A (DGEBA) cured with 4,4'-diaminodiphenylmethane (DDM) was monitored in situ by mid-infrared (MIR) and near-infrared (NIR) spectroscopy. With the help of generalized two-dimensional (2D) correlation analysis, the results obtained showed that, during curing, the change of amine and epoxy groups was simultaneous, taking place prior to the change of hydroxyl groups, followed by the change of CH(2)/CH groups, resulting from the ring-opening reaction of epoxy groups. In addition, 2D MIRxNIR hetero-spectral correlation analysis and second-derivative analysis were also employed, by means of which direct evidence of the curing mechanism could be obtained and obscure NIR band assignments in the overlapped CH combination region could be made.
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