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Updated: Jun 28, 2026

Comprehensive Characterization of Extended Defects in Semiconductor Materials by a Scanning Electron Microscope
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Defect characterization using an ultrasonic array to measure the scattering coefficient matrix.

Jie Zhang1, Bruce W Drinkwater, Paul D Wilcox

  • 1Department of Mechanical Engineering, University Walk, University of Bristol, Bristol, UK. j.zhang@bristol.ac.uk

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
|November 7, 2008
PubMed
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Measuring a cracklike defect's scattering coefficient matrix using ultrasonic nondestructive evaluation accurately determines its size, shape, and orientation. This method enhances structural integrity assessments, especially for small defects.

Area of Science:

  • Materials Science
  • Acoustics
  • Nondestructive Evaluation

Background:

  • Accurate defect sizing is crucial for structural integrity, particularly for defects smaller than the ultrasonic wavelength.
  • Ultrasonic nondestructive evaluation (NDE) is a key technique for detecting and characterizing material flaws.

Purpose of the Study:

  • To demonstrate the use of scattering coefficient matrices for characterizing cracklike defects.
  • To determine defect size, shape, and orientation using ultrasonic scattering properties.

Main Methods:

  • Utilized finite element (FE) modeling to predict scattering coefficient matrices of defects.
  • Employed a subarray approach with a 64-element, 5 MHz array for focused ultrasonic interrogation.
  • Experimentally validated the method on aluminum samples with machined slots and circular holes.

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Main Results:

  • Scattering coefficient matrices successfully distinguished between circular holes and fine slots.
  • Defect orientation was determined with accuracy within a few degrees.
  • Slot lengths were measured with a 10% error.

Conclusions:

  • Scattering coefficient matrix measurement is an effective method for ultrasonic defect characterization.
  • The technique provides accurate sizing and orientation determination for cracklike defects.
  • This approach improves structural integrity assessments in materials science and engineering.