Three-dimensional atom mapping of boron in implanted silicon
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Updated: Jun 27, 2026

Probing C84-embedded Si Substrate Using Scanning Probe Microscopy and Molecular Dynamics
Published on: September 28, 2016
O Cojocaru-Mirédin1, E Cadel, B Deconihout
1Université de Rouen, GPM, UMR CNRS 6634, BP 12, Avenue de l'Université, 76801 Saint Etienne de Rouvray, France.
Abstract:
The redistribution of boron in highly implanted 100 silicon (10keV; 5x10(15)at/cm(2)) annealed at 600 degrees C for 1h was studied using both laser-assisted wide-angle atom probe (LaWaTAP) and secondary ion mass spectrometry (SIMS). As expected, the concentration was found to increase steeply to 10(21) boron atoms/cm(3) at a distance close to 35nm and to decrease slowly to 10(19)/cm(3), a value close to the boron level of the silicon substrate. For depth under 75nm, the implantation profile of boron as given by LaWaTAP was found very close to that given by SIMS investigations without any calibration of the LaWaTAP data. For larger depth, the LaWaTAP profile is observed above that of SIMS. Detection limits of LaWaTAP for low dopant concentrations are discussed. The contribution of the background noise in the spectrum and sampling errors are considered. Fine-scale fluctuations not detected in SIMS profile and related to clustering were evidenced in LaWaTAP maps and profiles. Numerous boron clusters lying on {001} planes parallel to the implanted surface, a few nanometer in size, were identified and interpreted as boron interstitial clusters (BICs), in agreement with Cristiano et al. observations. They contained between 50 and 300 atoms (Si and B). This is much higher than that generally assumed in particular in ab-initio modelling where a few atoms BICs are considered. These clusters contained 7at% of boron in average.
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