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Updated: Jun 27, 2026

Fabrication and Characterization of Thickness Mode Piezoelectric Devices for Atomization and Acoustofluidics
Published on: August 5, 2020
Transverse surface waves in a layered structure with a functionally graded piezoelectric substrate and a hard
Zheng-Hua Qian1, Feng Jin, Tianjian Lu
1Department of Engineering Mechanics, Xi'an Jiaotong University, Xi'an 710049, Shaanxi Province, PR China. qian.z.aa@m.titech.ac.jp
This study investigates transverse surface waves in layered piezoelectric structures. Optimizing the gradient coefficient enhances electromechanical coupling and reduces wave penetration depth, crucial for advanced sensor applications.
Area of Science:
- Solid State Physics
- Materials Science
- Acoustics
Background:
- Functionally graded piezoelectric materials offer tunable properties.
- Layered structures are essential for wave propagation studies.
- Transverse surface waves have applications in sensors and actuators.
Purpose of the Study:
- To analyze the existence and propagation of transverse surface waves.
- To investigate the influence of a gradient coefficient on wave characteristics.
- To explore conditions for high electromechanical coupling and reduced penetration depth.
Main Methods:
- Analytical technique for wave propagation analysis.
- Derivation of dispersion equations for open and short circuit conditions.
- Numerical investigation of gradient coefficient effects.
Main Results:
- Dispersion equations for transverse surface waves were obtained.
- The gradient coefficient significantly impacts the dispersion relation.
- High electromechanical coupling factors were achieved by adjusting the gradient coefficient.
- Penetration depth was reduced to the order of the wavelength.
Conclusions:
- Functionally graded piezoelectric substrates enable control over transverse surface wave properties.
- Tailoring the gradient coefficient is key to optimizing electromechanical coupling and wave confinement.
- The findings are relevant for designing efficient piezoelectric devices and sensors.
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