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Optical confinement methods for continued scaling of CMOS image sensor pixels.

Christian C Fesenmaier1, Yijie Huo, Peter B Catrysse

  • 1Department of Electrical Engineering, Stanford University, Stanford, CA 94305, USA.

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Smaller CMOS image sensor pixels require improved optical efficiency and reduced crosstalk. New light-guiding methods using total internal reflection (TIR) and metal-dielectric interfaces show significant performance gains.

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Area of Science:

  • Optoelectronics
  • Semiconductor device physics
  • Nanophotonics

Background:

  • Pixel scaling in CMOS image sensors reduces light collection and increases optical crosstalk due to diffraction.
  • Maintaining high optical efficiency and minimizing spatial crosstalk are critical for advanced image sensor performance.

Purpose of the Study:

  • To investigate and compare three novel light-guiding techniques for CMOS image sensor pixels.
  • To address challenges posed by decreasing pixel sizes, specifically reduced optical efficiency and increased spatial optical crosstalk.

Main Methods:

  • Simulations using the finite-difference time-domain (FDTD) method on a 1.75-micrometer pixel model.
  • Evaluation of two total internal reflection (TIR) based methods and one metal-dielectric interface method.
  • Analysis of on-axis and angled light incidence effects on optical efficiency and spatial crosstalk.

Main Results:

  • Significant (10%) improvement in optical efficiency demonstrated for TIR designs with optimized parameters.
  • Nearly complete elimination of spatial optical crosstalk achieved using metal-dielectric confinement.
  • Performance improvements comparable to thinning the image sensor stack were observed.

Conclusions:

  • Novel light-guiding structures effectively enhance optical efficiency and reduce crosstalk in scaled CMOS image sensors.
  • TIR and metal-dielectric interfaces offer viable solutions for overcoming limitations in small-pixel designs.
  • These advancements contribute to the development of higher-performance imaging technologies.