MOSFET Amplifiers
Cascaded Op Amps
You might also read
Articles linked to this work by shared authors, journal, and citation graph.
Updated: Jun 26, 2026

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
Deng Qinghua1, Peng Hansheng, Sui Zhan
1Laser Fusion Research Center, Chinese Academy of Engineering Physics, Mianyang, Sichuan, DC 621900, China. dqhaj@yahoo.com.cn
A novel coupling method enhances high-power laser-diode-array (LDA) end-pumped amplifiers. This technique achieves high coupling efficiency and a uniform pumping field simultaneously.
Area of Science:
Background:
Purpose of the Study:
Main Methods:
Main Results:
Conclusions: