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Design considerations for refractive solid immersion lens: application to subsurface integrated circuit fault

S H Goh1, C J R Sheppard, A C T Quah

  • 1Centre for Integrated Circuit Failure Analysis and Reliability, National University of Singapore, Singapore. gohszuhuat@nus.edu.sg

The Review of Scientific Instruments
|February 5, 2009
PubMed
Summary

This study optimizes refractive solid immersion lens (RSIL) performance for laser induced fault localization in integrated circuits. Key design parameters were identified, achieving 0.25 micrometer resolution and 15x signal enhancement for advanced failure analysis.

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Area of Science:

  • Integrated Circuit (IC) Technology
  • Optical Microscopy
  • Failure Analysis

Background:

  • Advanced integrated circuit (IC) technology leads to smaller, denser circuitries, challenging conventional laser-induced fault localization.
  • Existing laser-induced fault localization techniques struggle with the reduced effectiveness caused by these technological advancements.
  • Improved spatial resolution and sensitivity are crucial for effective failure analysis in modern ICs.

Purpose of the Study:

  • To identify and characterize key refractive solid immersion lens (RSIL) design parameters for optimizing laser-induced fault localization.
  • To understand the resolution performance of RSIL at various focal planes beyond ideal configurations.
  • To enhance the sensitivity and spatial resolution of laser-induced fault localization systems.

Main Methods:

  • Development and implementation of RSIL on a laser scanning optical microscope.
  • Characterization of RSIL design parameters, including focal planes and mechanical clear aperture.
  • Evaluation of resolution and sensitivity enhancement for laser-induced techniques.

Main Results:

  • Optimal RSIL performance achieved near aplanatic design (20-25 micrometers for a 1 mm lens).
  • Minimum numerical aperture backing objective recommended for optimal resolution.
  • A resolution of 0.25 micrometers was quantitatively achieved with a 0.4 micrometer pitch structure resolvable.
  • Approximately 15 times enhancement in laser-induced signal was obtained.

Conclusions:

  • RSIL design parameters significantly impact laser-induced fault localization performance.
  • Aplanatic RSIL designs and appropriate backing objectives are critical for achieving high resolution and sensitivity.
  • The developed RSIL system offers substantial improvements for failure analysis in advanced ICs.