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Updated: Jun 25, 2026
Application of a Coupling Agent to Improve the Dielectric Properties of Polymer-Based Nanocomposites
Published on: September 19, 2020
Nanofiller loading level: Influence on selected properties of an adhesive resin
M C M Conde1, C H Zanchi, S A Rodrigues-Junior
1Biomaterials Development and Control Center, Federal University of Pelotas, RS, Brazil.
Objectives:
To evaluate the effect of the filler content in the cohesive strength (sigma), Weibull modulus (m) and degree of conversion (DC) of an experimental adhesive system.
Methods:
A HEMA/Bis-GMA/TEGDMA-based adhesive was formulated and filled with silica nanofillers in the following weight percentages (wt%): R0=0%; R1=1%; R3=3%; R5=5% and R10=10%. The adhesive of Adper Scotchbond Multi-Purpose (SBMP) system was used as a commercial reference. Twenty dumbbell-shaped specimens with cross-sectional area of 0.5mm(2) were made per group and tensile tested with a crosshead speed of 0.5mm/min until fracture. The cohesive strength was calculated in MPa. DC was obtained through FTIR after light curing for 25s. Data were submitted to one-way ANOVA and Tukey's test (alpha=0.05) and to Weibull analysis.
Results:
Mean sigma results were: R0=65.4+/-8.4; R1=73.2+/-8.8; R3=72.0+/-8.4; R5=73.1+/-9.7; R10=85.5+/-13.1 and SBMP=79.0+/-11.0MPa. R10 presented the highest sigma, while R0 showed the lowest. R5 and SBMP did not differ significantly (p<0.05). Weibull analysis revealed no significant difference in structural reliability between groups. The experimental adhesives presented similar results of DC, which, in turn, were significantly higher than the SBMP.
Conclusions:
The addition of 10% filler in weight improves the cohesive strength of the adhesive, not interfering in the structural reliability or the degree of conversion.
