A comparison of a second- and a third-generation modular cup design: is new improved?

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High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
07:51

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Published on: December 23, 2013

Cara C Powers1, Henry Ho, Sarah E Beykirch

  • 1Anderson Orthopaedic Research Institute, Alexandria, Virginia 22307, USA.

The Journal of Arthroplasty
|April 14, 2009
PubMed

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