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Updated: Jun 23, 2026

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
Published on: January 9, 2014
S Ruffell1, J E Bradby, J S Williams
1Department of Electronic Materials Engineering, Research School of Physics and Engineering, Australian National University, Canberra, 0200, Australia. simon.ruffell@anu.edu.au
Elevated temperatures enhance silicon phase transformation during nanoindentation unloading. The nucleation of Si-III/Si-XII phases depends on temperature and silicon matrix type.
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