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Related Experiment Video

Updated: Jun 23, 2026

Digital Inline Holographic Microscopy (DIHM) of Weakly-scattering Subjects

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Published on: February 8, 2014

High depth of field microscopic imaging using an interferometric camera.

P Potuluri, M Fetterman, D Brady

|May 8, 2009

Summary

This study introduces a novel microscope integrating rotational shear interferometry (RSI) with objective lenses. The instrument achieves simultaneous high numerical aperture and high depth of field imaging, enhancing microscopy capabilities.

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Three-dimensional Super Resolution Microscopy of F-actin Filaments by Interferometric PhotoActivated Localization Microscopy (iPALM)

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Published on: December 1, 2016

Area of Science:

Optical microscopy
Interferometry
Coherence imaging

Background:

Traditional microscopes face trade-offs between numerical aperture (NA) and depth of field (DOF).
Achieving both high NA and high DOF simultaneously is crucial for detailed 3D imaging in various scientific fields.

Purpose of the Study:

To design and demonstrate a microscope system that overcomes the NA-DOF limitation.
To integrate rotational shear interferometer (RSI)-based coherence imaging with a high-NA objective lens.

Main Methods:

Development of a microscope incorporating an RSI module and a high numerical aperture objective lens.
Utilizing coherence imaging principles for enhanced optical sectioning and resolution.
Experimental validation of the integrated system's performance.

Main Results:

The designed microscope successfully achieves simultaneous high numerical aperture and high depth of field imaging.
Experimental results demonstrate the effective operation and capabilities of the novel instrument.
The system provides a new approach for advanced microscopic visualization.

Conclusions:

The combined RSI and objective lens system offers a significant advancement in microscopy design.
This instrument enables simultaneous high-resolution and extended depth imaging, beneficial for biological and material sciences.
Further development could expand applications in fields requiring detailed 3D microscopic analysis.