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Updated: Jun 23, 2026
Fabrication of Large-area Free-standing Ultrathin Polymer Films
Published on: June 3, 2015
Ultra-low-k thin films of polyhedral oligomeric silsesquioxane/epoxy nanocomposites via covalent layer-by-layer
Ying-Ling Liu1, Chuan-Shun Liu, Wei-Hong Chen
1Department of Chemical Engineering and R&D Center for Membrane Technology, Chung Yuan Christian University, Chungli, Taoyuan 320, Taiwan.
Abstract:
Polyhedral oligomeric silsesquioxane nanocomposites thin films on silicon surfaces were prepared by covalent layer-by-layer (LbL) assembly using octakis(glycidyldimethylsiloxy)octasilsesquioxane (OG-POSS) and 4,4(hexafluoroisopropylidene)dianiline (HID) as building blocks. The layer thickness increased linearly with the layer numbers. An ultra-low dielectric constant of approximately 1.57 was found with the LbL thin film. A novel approach to fabricate ultra low-k materials is demonstrated.
