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Scatterometry-based metrology with feature region signatures matching.

Yi-Sha Ku, Shih-Chun Wang, Deh-Ming Shyu

    Optics Express
    |June 17, 2009
    PubMed
    Summary

    Scatterometry, a lithographic process monitoring technique, uses optical diffraction from periodic structures. A new feature region algorithm efficiently extracts grating structure parameters, reducing measurement and library matching needs.

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    Area of Science:

    • Optical physics
    • Materials science
    • Nanotechnology

    Background:

    • Scatterometry is a sensitive technique for monitoring lithographic processes.
    • Optical diffraction from periodic structures provides valuable information about nanoscale features.
    • Accurate and efficient extraction of structural parameters is crucial for process control.

    Purpose of the Study:

    • To develop an efficient algorithm for extracting grating structure parameters from scatterometry data.
    • To improve the speed and accuracy of lithographic process monitoring.
    • To reduce the computational resources required for analyzing diffraction data.

    Main Methods:

    • A feature region measurement algorithm was developed.
    • The algorithm identifies angles with maximal information content for surface relief profile determination.

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  • A library data matching process was employed to determine grating structure.
  • Main Results:

    • The feature region algorithm accurately and quickly extracts constitutive parameters from diffraction data.
    • The method efficiently determines grating structure by selecting informative reflectance angles.
    • Significant reductions in the number of measurements and signature matching library size were achieved.

    Conclusions:

    • The developed feature region algorithm enhances the efficiency of scatterometry for lithographic process monitoring.
    • This method offers a faster and more resource-efficient approach to nanoscale metrology.
    • The algorithm's ability to reduce data requirements makes it suitable for high-throughput industrial applications.