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Three-dimensional surface profile measurement using a beam scanning chromatic confocal microscope.

Byung Seon Chun1, Kwangsoo Kim, Daegab Gweon

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This study presents a new 3D surface measurement technique using chromatic confocal microscopy and transverse beam scanning. It reconstructs 3D profiles by correlating wavelength and scanning angle to surface coordinates without mechanical translation.

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Area of Science:

  • Optical Metrology
  • Surface Characterization
  • Microscopy Techniques

Background:

  • Traditional 3D surface measurement often requires longitudinal mechanical translation.
  • Chromatic confocal microscopy offers high axial resolution but can be limited in lateral scanning.
  • Integrating transverse beam scanning aims to overcome these limitations.

Purpose of the Study:

  • To develop and demonstrate a 3D surface measurement method using chromatic confocal microscopy with transverse point beam scanning.
  • To eliminate the need for longitudinal mechanical translation in 3D surface profiling.
  • To establish the relationship between wavelength, scanning angle, and spatial coordinates for accurate reconstruction.

Main Methods:

  • Construction of a chromatic confocal microscopy system with transverse point beam scanning.
  • Determination of wavelength-to-depth relation and lateral field of view based on beam scanning angle.
  • Experimental measurement of a sample structure.

Main Results:

  • Successful three-dimensional surface profile reconstruction was achieved.
  • The method demonstrated effective 3D measurement without longitudinal mechanical translation.
  • Experimental results validated the correlation between optical parameters and spatial coordinates.

Conclusions:

  • The developed beam scanning chromatic confocal microscopy is a viable technique for 3D surface measurement.
  • This approach offers advantages by avoiding complex mechanical translation systems.
  • Accurate 3D surface profiling can be obtained by carefully considering optical parameters and scanning geometry.