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Updated: Jun 21, 2026

Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors
Published on: June 23, 2018
Active pixel imagers incorporating pixel-level amplifiers based on polycrystalline-silicon thin-film transistors
Youcef El-Mohri1, Larry E Antonuk, Martin Koniczek
1Department of Radiation Oncology, University of Michigan Medical Center, Ann Arbor, Michigan 48109 USA. elmohri@umich.edu
This study introduces active pixel (AP) architectures using polycrystalline-silicon (poly-Si) thin-film transistors (TFTs) to enhance x-ray imaging signal gain. While early prototypes showed no net signal-to-noise improvement, poly-Si AP circuits offer tailored gain and reduced charge trapping for future advancements.
Area of Science:
- Materials Science
- Electrical Engineering
- Medical Imaging Technology
Background:
- Active matrix, flat-panel imagers (AMFPIs) using amorphous silicon (a-Si) TFTs are standard in x-ray imaging.
- Their signal-to-noise ratio (SNR) is limited by modest system gain and electronic noise, especially at low exposures or high resolutions.
- Existing designs face constraints in achieving higher performance metrics crucial for advanced diagnostic imaging.
Purpose of the Study:
- To investigate the efficacy of incorporating in-pixel amplification circuits, termed active pixel (AP) architectures, using polycrystalline-silicon (poly-Si) TFTs.
- To overcome the signal-to-noise limitations of conventional a-Si based AMFPIs.
- To evaluate the performance of prototype arrays with varying levels of in-pixel amplification.
Main Methods:
- Developed three prototype indirect detection arrays using poly-Si TFTs and a continuous a-Si photodiode structure.
- Prototypes included a reference array (PSI-1) with a single TFT and two AP arrays (PSI-2, PSI-3) with three and five TFTs, respectively.
- Characterized x-ray sensitivity, charge trapping, modulation transfer function (MTF), and noise performance.
Main Results:
- Poly-Si AP architectures (PSI-2, PSI-3) demonstrated significant signal gains of approximately 10.7x and 20.9x compared to the reference (PSI-1).
- PSI-3 exhibited substantially lower charge trapping compared to PSI-1 and PSI-2, largely independent of bias voltage.
- Despite high additive noise in early prototypes, PSI-3 achieved a significantly lower noise level of ~560 e (rms) due to faster readout and multi-sampling capabilities.
Conclusions:
- Poly-Si TFTs enable sophisticated AP designs capable of achieving tailored signal gain for improved x-ray imaging.
- The PSI-3 design shows promise for future low-noise, high-performance imaging systems by mitigating charge trapping and leveraging advanced readout techniques.
- Further optimization is needed to fully realize the potential of poly-Si AP architectures for net SNR improvement in practical applications.
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