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Updated: Jun 19, 2026

Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
Published on: December 7, 2015
Thermal boundary resistances of carbon nanotubes in contact with metals and polymers
Qingwei Li1, Changhong Liu, Shoushan Fan
1Tsinghua-Foxconn Nanotechnology Research Center and Department of Physics, Tsinghua University, Beijing 100084, People's Republic of China.
Abstract:
In recent years carbon-nanotube-based thermal interface materials have shown great potential for solving the thermal management problem of integrated circuits and nanodevices. For a long time, the exceptionally high thermal boundary resistances (TBRs) between carbon nanotubes (CNTs) and their surroundings have been suspected as a major factor to restraining their performance. But so far, there are few or no reported work to determine or compare the TBRs between CNTs and various materials. In this paper, we carefully design and carry out the TBR measurements of CNTs in contact with metal and polymer materials, and we present a conclusion that the CNT/polymer generally gives a lower TBR compared to the CNT/metal, which seems a little counterintuitive. We further suggest that the larger CNT-metal TBRs arise from the smaller phonon-mode overlapping between the CNT and the metals at low frequencies, and the low phonon transmission coefficient at the metal-CNT interface in the intermediate and high frequency range. This work may inspire deeper understanding of the TBR and shed light on related theoretical and applied research.
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