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Updated: Jun 18, 2026
08:45
Shrinkage of Dental Composite in Simulated Cavity Measured with Digital Image Correlation
Published on: July 21, 2014
Relationship between microtensile bond strength and submicron hiatus at the composite-dentin interface using CLSM
Paul G F Ding1, Axel R A H Matzer, Diana Wolff
1Department of Conservative Dentistry, Clinic for Oral, Dental and Maxillofacial Diseases, University Hospital Heidelberg, Germany. paul.ding@med.uni-heidelberg.de
Summary
Submicron hiatus formations negatively impact resin-dentin bond strength. This study found a significant correlation between hiatus presence and reduced microtensile bond strength (microTBS) in dental bonding materials.
Area of Science:
- Dental Materials Science
- Adhesive Dentistry
- Biomaterials Interface
Background:
- The "submicron hiatus" is a critical interface in resin-dentin bonding, representing a potential gap.
- Understanding factors affecting the resin-dentin interface is crucial for durable dental restorations.
Purpose of the Study:
- To investigate the relationship between submicron hiatus formation and microtensile bond strength (microTBS).
- To evaluate this relationship using two different bonding systems.
Main Methods:
- Two resin-dentin bonding systems (Syntac Classic and Prime & Bond NT) were used to prepare micro-specimens.
- Submicron hiatus formations were visualized non-destructively using confocal laser scanning microscopy (CLSM) after labeling with rhodamine-B-isothiocyanate.
- Specimens were subsequently tested for microtensile bond strength.
Main Results:
- A significant negative correlation was observed between the degree of submicron hiatus formation and microTBS for both bonding systems (Syntac Classic: r=-0.329, p=0.02; Prime & Bond NT: r=-0.356, p=0.007).
- Overall, a correlation coefficient of -0.341 (p=0.001) indicated a general inverse relationship between hiatus presence and microTBS.
- Strong positive correlations were found between microTBS and the quality of the hybrid layer (r=0.849, p=0.001) and tag formation (r=0.474, p=0.001).
Conclusions:
- The extent of submicron hiatus formations significantly influences microtensile bond strength.
- This finding highlights the importance of minimizing interface gaps for achieving optimal bond strength in dental adhesive procedures.
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