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Towards circuit integration on fully flexible parylene substrates.

Ke Wang¹, Marice van Deurzen, Nico Kooyman

¹Minimally Invasive Healthcare Department, Philips Research, Eindhoven, The Netherlands. ke.wang@philips.com

Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference

|December 8, 2009

Summary

This summary is machine-generated.

A new substrate transfer technology enables device fabrication using silicon methods before parylene integration. This allows for high-quality, flexible, and biocompatible devices for applications like neural interfaces.

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Area of Science:

Materials Science
Biomedical Engineering
Electrical Engineering

Background:

Conventional fabrication methods often limit substrate choices for advanced devices.
Integrating high-performance electronic components with flexible, biocompatible materials presents significant challenges.

Purpose of the Study:

To introduce a novel substrate transfer technology for device fabrication.
To enable the use of conventional silicon-based processing for devices integrated with parylene.

Main Methods:

Development of a substrate transfer technique.
Fabrication of parylene-based metal microelectrode arrays.
Integration of high-temperature silicon oxide passivation layers.

Main Results:

Demonstration of a functional parylene-based metal microelectrode array.
Successful integration of devices processed with conventional silicon techniques onto flexible substrates.
Achieved high-quality device performance combined with substrate flexibility and biocompatibility.

Conclusions:

The presented substrate transfer technology facilitates the creation of advanced electronic devices.
This approach merges the benefits of established silicon processing with the advantages of thin, flexible, and biocompatible parylene substrates.
The technology holds significant promise for biomedical applications, particularly in the development of implantable neural interfaces.