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Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices

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Room-temperature intermediate layer bonding for microfluidic devices.

Jacob Bart¹, Roald Tiggelaar, Menglong Yang

¹Mesoscale Chemical Systems, MESA+ Institute for Nanotechnology, University of Twente, PO Box 217, 7500 AE Enschede, The Netherlands.

|December 22, 2009

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A novel room-temperature bonding method uses chemically activated Fluorinated Ethylene Propylene (FEP) sheets for robust microfluidic chip assembly. This technique enables strong, leak-proof bonds for microfluidic systems and MEMS devices.

Area of Science:

Materials Science
Chemical Engineering
Microfluidics

Background:

Microfluidic systems require reliable bonding techniques for fabrication.
Existing methods often involve high temperatures or complex processes.
Room-temperature bonding is desirable for sensitive materials and low-cost manufacturing.

Purpose of the Study:

To present a novel room-temperature bonding technique using chemically activated Fluorinated Ethylene Propylene (FEP) as an intermediate layer.
To demonstrate the efficacy of this method for bonding various substrates, including silicon and glass.
To evaluate the mechanical strength and fluidic performance of the resulting bonds.

Main Methods:

Chemically activating silicon and glass substrates with amine terminal groups (APTES).

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Treating FEP sheet surfaces to form carboxyl groups and activating them using EDC-NHS chemistry.

Bonding substrates by pressing amine-terminated surfaces against the activated FEP intermediate layer at room temperature.

Characterizing surface activation using contact angle measurements and X-ray photoelectron spectroscopy (XPS).

Main Results:

Achieved robust room-temperature bonds between silicon-silicon (5.9 MPa tensile strength) and glass-glass (5.2 MPa tensile strength).
Demonstrated reliable fluidic operation up to 10.2 bar pressure.
Confirmed that FEP-bonded microfluidic chips can withstand mild organic solvents at elevated pressures without leakage.

Conclusions:

The presented intermediate layer bonding technique offers a versatile, room-temperature solution for microfluidic device fabrication.
This method is suitable for bonding various materials and is compatible with microelectromechanical systems (MEMS) assembly.
The technique shows high potential for low-cost, efficient manufacturing of microfluidic and MEMS devices.