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Updated: Jun 17, 2026

Lensless Fluorescent Microscopy on a Chip
Published on: August 17, 2011
Thin film Ag superlens towards lab-on-a-chip integration
C Jeppesen1, R B Nielsen, A Boltasseva
11Department of Micro and Nanotechnology, Technical University of Denmark, DTU Nanotech, DTU-building 345 east, DK-2800 Kongens Lyngby, Denmark.
Abstract:
A thin metal film near-field superlens, as originally suggested by Pendry and realized by Fang et al. and Melville et al., is investigated with emphasis on materials suitable for integration on a lab-on-a-chip platform. A chemically resistant cyclo-olefin copolymer (COC), mr-I-T85 from microresist technology, is applied as dielectric matrix/spacer for an Ag thin film superlens. The superlens successfully resolves 80 nm half-pitch gratings when illuminated with UV radiation at a free space wavelength of 365 nm. The superlens design, fabrication and characterization is discussed.

