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Updated: Jun 16, 2026

Split Point Analysis and Uncertainty Quantification of Thermal-Optical Organic/Elemental Carbon Measurements
Published on: September 7, 2019
Controllable optical emission spectroscopy diagnostic system for analysis of process chemistries
P L Stephan Thamban1, Jimmy Hosch, M J Goeckner
1Department of Electrical Engineering, University of Texas at Dallas, Richardson, Texas 75083-0688, USA.
A novel optical emission spectroscopy (OES) system using variable electron beams (e-beam) enhances plasma etch endpoint detection. This method correlates optical signals with e-beam current for improved plasma process control and analysis.
Area of Science:
- Plasma Physics
- Materials Science
- Process Engineering
Background:
- Optical emission spectroscopy (OES) is a standard technique for plasma etch end point detection.
- Newer plasma systems present challenges due to low optical emission or limited optical access, hindering traditional OES effectiveness.
Purpose of the Study:
- To develop and present a novel OES diagnostic system utilizing a variable electron beam (e-beam) to overcome limitations in plasma etch end point detection.
- To demonstrate the feasibility and advantages of this e-beam enhanced OES system through initial experimental results.
Main Methods:
- Development of a new OES diagnostic system incorporating a variable electron beam.
- Experimental testing to evaluate the system's performance and data acquisition capabilities.
- Analysis of the correlation between optical emission intensity and e-beam current.
Main Results:
- A strong correlation was observed between optical emission intensity and e-beam current, a measurable electrical parameter.
- The observed correlation provides a method for normalizing optical signals and enabling feedback control of the plasma source.
- Different spectral lines showed measurable responses based on electron energy, indicating a new diagnostic parameter.
Conclusions:
- The developed variable e-beam OES system effectively addresses limitations of traditional OES in challenging plasma environments.
- The correlation between optical emission and e-beam current allows for robust signal normalization and closed-loop plasma process control.
- The energy-dependent response of spectral lines offers enhanced analytical capabilities for precise end point determination in plasma etching.
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