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High contrast, depth-resolved thermoreflectance imaging using a Nipkow disk confocal microscope.

J A Summers¹, T Yang, M T Tuominen

¹Department of Physics, Mount Holyoke College, South Hadley, Massachusetts 01075, USA.

The Review of Scientific Instruments

|February 2, 2010

Summary

We developed a new thermal imaging technique using a confocal microscope to accurately measure device temperatures, even with obstructions. This method overcomes limitations of traditional thermoreflectance imaging for encapsulated or partially hidden devices.

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The Frequency Domain Thermoreflectance Technique for Thermal Property Measurements

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Area of Science:

Optics and Photonics
Thermal Engineering
Materials Science

Background:

Accurate temperature measurement is crucial for device characterization and reliability.
Traditional thermoreflectance imaging struggles with obstructions and reflections.
Encapsulated or semi-obstructed devices present unique thermal imaging challenges.

Purpose of the Study:

To develop a depth-resolved confocal thermal imaging technique.
To enable temperature distribution measurement of encapsulated or semi-obstructed devices.
To overcome limitations of widefield thermoreflectance in obstructed environments.

Main Methods:

Utilized lock-in charge coupled device (CCD)-based thermoreflectance imaging.
Employed a Nipkow disk confocal microscope to eliminate out-of-focus reflections.
Quantified contrast and dynamic range reduction caused by obstructions in widefield thermoreflectance.

Main Results:

Demonstrated high contrast and thermal sensitivity with confocal thermoreflectance.
Successfully measured temperature distribution in the presence of significant reflecting obstructions.
Validated the technique's ability to image through or around optical obstructions.

Conclusions:

Confocal thermoreflectance imaging is effective for temperature mapping of obstructed devices.
The technique significantly improves thermal imaging capabilities for complex device structures.
This method offers a robust solution for non-invasive thermal analysis in challenging conditions.