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Related Concept Videos

Three-Dimensional Analysis of Strain01:29

Three-Dimensional Analysis of Strain

Three-dimensional strain analysis is crucial for understanding how materials deform under stress, particularly in elastic, homogeneous materials. This method employs principal stress axes to simplify complex stress states into more understandable forms. Subjected to stress, a small cubic element within a material either expands or contracts along these axes, transforming into a rectangular parallelepiped. This transformation effectively illustrates the material's deformation. The principal...
Measurements of Strain01:27

Measurements of Strain

Strain quantifies the deformation of a material under force, typically measured as normal strain, which represents the change in length when compared with the original length. Electrical strain gauges are used for enhanced accuracy. These devices consist of a conductive wire mounted on a paper backing that adheres to the material's surface. These gauges operate on the piezoresistive effect, where the wire's electrical resistance changes in response to mechanical deformation. The strain gauge...
Principal Stresses01:24

Principal Stresses

The graphical depiction of normal and shearing stress equations is represented by a circle, demonstrating the interplay between these stresses under different angular conditions. The center of this circle C, located on the vertical axis, represents the average normal stress, while its radius shows the range of stress variations. At points A and B, where the circle intersects the horizontal axis, the maximum and minimum normal stresses are observed, occurring without shearing stress. These...
Distribution of Stresses in a Narrow Rectangular Beam01:11

Distribution of Stresses in a Narrow Rectangular Beam

In studying beam stress distribution, examining an elemental section is essential. To determine the average shearing stress on this face, the calculated shear is divided by the surface area. Importantly, shearing stresses on the beam's transverse and horizontal planes mirror each other, indicating a consistent stress distribution along the upper region of the beam. Notably, shearing stresses are absent at the beam's upper and lower surfaces due to the absence of applied forces in these areas.
Transformation of Plane Stress01:18

Transformation of Plane Stress

Studying stress transformation is essential in understanding how stress components within a material, like a cube under plane stress, change with rotation. This change is analyzed by considering a prismatic element within the cube. As the element rotates, the stress components acting on it—both normal and shearing stresses—change in magnitude and orientation. This change is quantified using trigonometric functions of the rotation angle, relating the forces acting on the rotated element's faces...
Mohr's Circle for Plane Stress01:23

Mohr's Circle for Plane Stress

Mohr's circle is a graphical method for identifying the state of stress at a point in a material, making it easier to analyze stress transformations under plane stress conditions. This two-dimensional technique visualizes both normal and shearing stresses on an element.
Consider a set of Cartesian coordinates. The horizontal and vertical axes correspond to normal stress (σ) and shearing stress (τ), respectively. Two points, points A and B, are defined by the normal and shear stresses on the...

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Related Experiment Video

Updated: Jun 16, 2026

In Situ Measurement of Vacuum Window Birefringence using 25Mg+ Fluorescence
07:03

In Situ Measurement of Vacuum Window Birefringence using 25Mg+ Fluorescence

Published on: June 13, 2020

Interferometric Null Method for Measuring Stress-induced Birefringence.

G Birnbaum, E Cory, K Gow

    Applied Optics
    |February 6, 2010
    PubMed
    Summary
    This summary is machine-generated.

    A new scanning Fabry-Perot interferometer system precisely measures birefringence in materials like YAG and sapphire. This sensitive apparatus uses a Kerr cell to cancel optical path differences caused by stress-induced birefringence.

    More Related Videos

    Micro/Nano-scale Strain Distribution Measurement from Sampling Moiré Fringes
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    Micro/Nano-scale Strain Distribution Measurement from Sampling Moiré Fringes

    Published on: May 23, 2017

    Fabrication Procedures and Birefringence Measurements for Designing Magnetically Responsive Lanthanide Ion Chelating Phospholipid Assemblies
    09:38

    Fabrication Procedures and Birefringence Measurements for Designing Magnetically Responsive Lanthanide Ion Chelating Phospholipid Assemblies

    Published on: January 3, 2018

    Related Experiment Videos

    Last Updated: Jun 16, 2026

    In Situ Measurement of Vacuum Window Birefringence using 25Mg+ Fluorescence
    07:03

    In Situ Measurement of Vacuum Window Birefringence using 25Mg+ Fluorescence

    Published on: June 13, 2020

    Micro/Nano-scale Strain Distribution Measurement from Sampling Moiré Fringes
    06:56

    Micro/Nano-scale Strain Distribution Measurement from Sampling Moiré Fringes

    Published on: May 23, 2017

    Fabrication Procedures and Birefringence Measurements for Designing Magnetically Responsive Lanthanide Ion Chelating Phospholipid Assemblies
    09:38

    Fabrication Procedures and Birefringence Measurements for Designing Magnetically Responsive Lanthanide Ion Chelating Phospholipid Assemblies

    Published on: January 3, 2018

    Area of Science:

    • Optical physics
    • Materials science

    Background:

    • Birefringence, the optical property of a material having a refractive index that depends on the polarization and propagation direction of light, is crucial in many optical applications.
    • Accurate measurement of birefringence, especially stress-induced birefringence, is essential for material characterization and quality control.

    Purpose of the Study:

    • To develop a sensitive apparatus for measuring birefringence using a scanning Fabry-Perot interferometer.
    • To assess the stress-induced birefringence in YAG, sapphire, and fused silica within a specific temperature range.

    Main Methods:

    • Utilized a scanning Fabry-Perot interferometer excited by circularly polarized laser radiation.
    • Employed a Kerr cell within the interferometer to cancel sample birefringence by adjusting cell voltage.
    • Used the interferometer as a spectrum analyzer to observe resonance curve displacements for polarization-dependent path differences.
    • Calibrated the Kerr cell for a relative path retardation of lambda/2.

    Main Results:

    • Successfully measured stress-induced birefringence in YAG, sapphire, and fused silica.
    • Operated within the temperature range of 26-75 degrees C.
    • Assessed the accuracy and sensitivity of the developed instrument.

    Conclusions:

    • The developed scanning Fabry-Perot interferometer system is a sensitive and accurate instrument for measuring birefringence.
    • The method allows for precise characterization of stress-induced birefringence in various optical materials.