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Genuine full-field deformation measurement of an object with complex shape using reliability-guided digital image
Bing Pan1, Zhaoyang Wang, Zixing Lu
1Institute of Solid Mechanics, Beijing University of Aeronautics & Astronautics, Beijing, China. panb04@mails.tsinghua.edu.cn
Optics Express
|February 23, 2010
Summary
This study enhances digital image correlation (DIC) for accurate deformation measurement. New methods improve boundary point analysis and handle complex shapes, enabling full-field measurements on any object.
Area of Science:
- Optical Metrology
- Materials Science
- Mechanical Engineering
Background:
- Digital image correlation (DIC) is a key optical technique for measuring deformation.
- Existing DIC methods struggle with boundary points and geometric discontinuities, leading to data gaps.
- Accurate full-field deformation data is crucial for understanding material behavior.
Purpose of the Study:
- To address limitations in current digital image correlation (DIC) techniques.
- To develop improved methods for deformation measurement at region boundaries.
- To enhance the reliability and accuracy of DIC for complex shapes.
Main Methods:
- A modified Zero-mean Normalized Sum of Squared Differences (ZNSSD) criterion was developed for boundary subset analysis.
- A novel scanning strategy guided by correlation coefficients was implemented for complex regions of interest (ROIs).
- The enhanced DIC approach was validated using experimental image pairs.
Main Results:
- The improved DIC method accurately determines deformation for all points, including those at ROI boundaries.
- The technique overcomes issues with erroneous measurements near geometric discontinuities.
- Full-field deformation measurement is reliably achieved for objects with complex or arbitrary shapes.
Conclusions:
- The proposed DIC enhancements significantly improve accuracy and reliability in deformation measurement.
- This method enables comprehensive full-field analysis, even for challenging geometries.
- The improved DIC technique offers broad applicability in scientific and engineering fields.
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