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Development of experimental HEMA-free three-step adhesive system
Cesar Henrique Zanchi1, Eliseu Aldrigh Münchow, Fabricio Aulo Ogliari
1Biomaterials Development and Control Center, School of Dentistry, Federal University of Pelotas, Pelotas, RS, Brazil. chzanchi@gmail.com
Journal of Dentistry
|March 23, 2010
Summary
Bis-EMA 30 shows promise as a HEMA substitute in dental adhesives. The P40 formulation achieved bond strengths comparable to commercial standards, indicating enhanced reliability for etch-and-rinse systems.
Area of Science:
- Dental Materials Science
- Adhesive Dentistry
- Polymer Chemistry
Background:
- Dental adhesives are crucial for bonding restorative materials to tooth structure.
- Etch-and-rinse adhesive systems are widely used but can be technique-sensitive.
- Improving the reliability and bond strength of these systems is an ongoing research objective.
Purpose of the Study:
- To investigate the effect of Bis-EMA 30 on microtensile bond strength (microTBS) and structural reliability.
- To evaluate experimental three-step etch-and-rinse adhesive systems incorporating Bis-EMA 30.
- To compare the performance of experimental adhesives with a commercial reference system.
Main Methods:
- Five experimental primers with varying Bis-EMA 30 concentrations (0-60 wt%) were formulated.
- Bovine incisors were treated with an etch-and-rinse protocol and restored with experimental adhesives.
- Microtensile bond strength (microTBS) and Weibull analysis were performed on 24 specimens per group after 24-hour water storage.
Main Results:
- The P40 group (40 wt% Bis-EMA 30) exhibited microTBS similar to the Scotchbond MultiPurpose (SBMP) control.
- P40 demonstrated superior structural reliability, indicated by higher Weibull modulus and characteristic strength.
- Lower Bis-EMA 30 concentrations (P0, P10, P20) resulted in significantly lower microTBS and reliability.
Conclusions:
- Bis-EMA 30 is a viable alternative to HEMA in dental adhesive formulations.
- The P40 formulation shows potential for enhancing the performance of etch-and-rinse adhesives.
- Further research may validate Bis-EMA 30 as a key component in next-generation dental bonding agents.
