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Related Experiment Video

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Design and Use of a Full Flow Sampling System (FFS) for the Quantification of Methane Emissions

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Using optical correlation to measure leak rates in sealed packages.

J W Wagner¹, L C Phillips, E P Mueller

¹US Food & DrugAdministration, Bureau of Medical Devices, Center for Medical Device Analysis, 8757 Georgia Avenue, Silver Spring, Maryland 20910, USA.

|April 17, 2010

Summary

This study introduces an optical correlation technique for precise leak detection in microcircuit packages. The method measures dimensional changes to calculate leak rates, offering a valuable non-destructive quality control solution.

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Area of Science:

Materials Science
Optical Metrology
Quality Control

Background:

Microelectronic devices require stringent leak testing to ensure reliability.
Traditional leak detection methods can be time-consuming or destructive.
Accurate measurement of leak conduction rates is crucial for quality assurance.

Purpose of the Study:

To present and validate an optical correlation technique for measuring leak conduction rates.
To assess the applicability of this technique for hybrid microcircuit packages.
To establish the potential of this method as a non-destructive quality-control tool.

Main Methods:

Utilized hybrid microcircuit packages with controlled glass capillary leakers.
Applied an optical correlation technique to detect dimensional changes under external pressure variations.
Measured the rate of dimensional recovery to compute leak rates, incorporating internal free volume.

Main Results:

The optical correlation technique accurately measured leak conduction rates across a range of 10(-1) to 10(-6) atm cc/sec.
Demonstrated the ability to detect subtle dimensional changes in microcircuit packages.
Successfully computed leak rates based on dimensional recovery dynamics and internal free volume.

Conclusions:

The optical correlation technique provides accurate and sensitive leak rate measurements.
This method is suitable for non-destructive testing of microelectronic packages.
The technique offers significant advantages for quality control in microelectronics manufacturing.