New fabrication techniques for ring-array transducers for real-time 3D intravascular ultrasound

We have previously described miniature 2D array transducers integrated into a Cook Medical, Inc. vena cava filter deployment device. While functional, the fabrication technique was very labor intensive and did not lend itself well to efficient fabrication of large numbers of devices. We developed two new fabrication methods that we believe can be used to efficiently manufacture these types of devices in greater than prototype numbers. One transducer consisted of 55 elements operating near 5 MHz. The interelement spacing is 0.20 mm. It was constructed on a flat piece of copper-clad polyimide and then wrapped around an 11 French catheter of a Cook Medical, Inc. inferior vena cava (IVC) filter deployment device. We used a braided wiring technology from Tyco Electronics Corp. to connect the elements to our real-time 3D ultrasound scanner. Typical measured transducer element bandwidth was 20% centered at 4.7 MHz and the 50 Omega round trip insertion loss was --82 dB. The mean of the nearest neighbor cross talk was -37.0 dB. The second method consisted of a 46-cm long single layer flex circuit from MicroConnex that terminates in an interconnect that plugs directly into our system cable. This transducer had 70 elements at 0.157 mm interelement spacing operating at 4.8 MHz. Typical measured transducer element bandwidth was 29% and the 50 Omega round trip insertion loss was -83 dB. The mean of the nearest neighbor cross talk was -33.0 dB.