Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Concept Videos

Non-ohmic Devices00:51

Non-ohmic Devices

In most substances, the current flow is proportional to the voltage applied to it. A simple relationship between the values of current, voltage, and resistance is known as Ohm's law. Nonohmic devices do not exhibit a linear relationship between voltage and current. One such device is the semiconducting circuit element known as a diode. A diode is a circuit device that allows current flow in only one direction.
Consider a simple circuit consisting of a battery, a diode, and a resistor. A diode...
Bus Impedance Matrix01:24

Bus Impedance Matrix

Calculating subtransient fault currents for three-phase faults in an N-bus power system involves using the positive-sequence network. When a three-phase short circuit occurs at a specific bus, the analysis uses the superposition method to evaluate two separate circuits.
In the first circuit, all machine voltage sources are short-circuited, leaving only the prefault voltage source at the fault location. The positive-sequence bus impedance matrix can be determined by solving the nodal equations,...
Energy Stored In A Coaxial Cable01:31

Energy Stored In A Coaxial Cable

A coaxial cable consists of a central copper conductor used for transmitting signals, followed by an insulator shield, a metallic braided mesh that prevents signal interference, and a plastic layer that encases the entire assembly.
In the simplest form, a coaxial cable can be represented by two long hollow concentric cylinders in which the current flows in opposite directions. The magnetic field inside and outside the coaxial cable is determined by using Ampère's law. The magnetic field inside...
Semiconductors01:22

Semiconductors

There is variation in the electrical conductivity of materials - metals, semiconductors, and insulators that are showcased with the help of the energy band diagrams.
Metals such as copper (Cu), zinc (Zn), or lead (Pb) have low resistivity and feature conduction bands that are either not fully occupied or overlap with the valence band, making a bandgap non-existent. This allows electrons in the highest energy levels of the valence band to easily transition to the conduction band upon gaining...
Transmission Line Design Considerations01:23

Transmission Line Design Considerations

Aluminum has become the material of choice for overhead transmission lines, surpassing copper due to its abundance and cost-effectiveness. The most prevalent type is the aluminum conductor, steel-reinforced (ACSR), which combines aluminum strands around a steel core. Other variants include all-aluminum conductors (AAC), all-aluminum alloy conductors (AAAC), aluminum conductor alloy-reinforced (ACAR), and aluminum-clad steel conductors. Advanced designs, such as aluminum conductors with steel...

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Parallel fuzzy inference with an optoelectronic H-tree architecture.

Applied optics·2010
Same author

Motionless-head parallel-readout optical-disk system: experimental results.

Applied optics·2010
Same author

Photonic content-addressable memory system that uses a parallel-readout optical disk.

Applied optics·2010
Same author

Coplanar refractive-diffractive doublets for optoelectronic integrated systems.

Applied optics·2010
Same author

Digital free-space optical interconnections: a comparison of transmitter technologies.

Applied optics·2010
Same author

Guided-wave and free-space optical interconnects for parallel-processing systems: a comparison.

Applied optics·2010

Related Experiment Video

Updated: Jun 12, 2026

Measurement of Quantum Interference in a Silicon Ring Resonator Photon Source
12:19

Measurement of Quantum Interference in a Silicon Ring Resonator Photon Source

Published on: April 4, 2017

Comparison between electrical and free space optical interconnects for fine grain processor arrays based on

M R Feldman, C C Guest, T J Drabik

    Applied Optics
    |June 18, 2010
    PubMed
    Summary

    Optically interconnected processor arrays offer superior interconnect density compared to electronic arrays. This research shows optical circuits have lower area growth rates, outperforming traditional Very Large Scale Integration (VLSI) circuits.

    More Related Videos

    High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
    07:51

    High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

    Published on: December 23, 2013

    Quasi-light Storage for Optical Data Packets
    07:45

    Quasi-light Storage for Optical Data Packets

    Published on: February 6, 2014

    Related Experiment Videos

    Last Updated: Jun 12, 2026

    Measurement of Quantum Interference in a Silicon Ring Resonator Photon Source
    12:19

    Measurement of Quantum Interference in a Silicon Ring Resonator Photon Source

    Published on: April 4, 2017

    High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
    07:51

    High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

    Published on: December 23, 2013

    Quasi-light Storage for Optical Data Packets
    07:45

    Quasi-light Storage for Optical Data Packets

    Published on: February 6, 2014

    Area of Science:

    • Computer Engineering
    • Optical Computing
    • Integrated Circuit Design

    Background:

    • Conventional processor arrays rely on electronic interconnects, facing limitations in density and scalability.
    • Assessing the scalability of processor arrays requires analyzing their area growth rate with increasing processing elements.

    Purpose of the Study:

    • To compare the interconnect density capabilities of optically interconnected processor arrays versus fully electronic ones.
    • To introduce a complexity model for calculating array area growth rate as a function of processing elements.

    Main Methods:

    • Developed a complexity model to determine the asymptotic area growth rate of processor arrays.
    • Compared lower bounds for electrically interconnected arrays with upper bounds for free-space optically interconnected circuits using computer-generated holograms.

    Main Results:

    • Optically interconnected circuits demonstrate lower area growth rates than electrically interconnected ones.
    • For networks like hypercube and crossbar, optical interconnects achieve area growth rates below VLSI lower bounds.

    Conclusions:

    • Free-space optical interconnects offer a scalable solution for high-performance computing architectures.
    • Optical interconnects provide a significant advantage in interconnect density and area efficiency for complex processor arrays.