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Subpicosecond optical pulse compression via an integrated nonlinear chirper.

Marco Peccianti1, Marcello Ferrera, Luca Razzari

  • 1Ultrafast Optical Processing, INRS-EMT, Université du Québec, 1650 Blv. Lionel Boulet, Varennes, Québec J3X 1S2, Canada. peccianti@emt.inrs.ca

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We developed a novel photonic integrated circuit (PIC) for ultra-fast optical signal processing. This integrated nonlinear chirper enables sub-picosecond pulse compression, crucial for future high-bandwidth telecommunications.

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Area of Science:

  • Photonics
  • Integrated Optics
  • Nonlinear Optics

Background:

  • Photonic integrated circuits (PICs) are essential for meeting the increasing global demand for fiber-optic telecommunications bandwidth.
  • Integrated all-optical signal processors offer significant advantages in performance, cost, footprint, and energy efficiency.
  • Ultra-fast signal processing is critical for applications involving ultra-short optical pulse propagation.

Purpose of the Study:

  • To demonstrate an optical pulse compressor based on an integrated nonlinear chirper.
  • To achieve pulse compression on a sub-picosecond timescale (> 1Tb/s).
  • To leverage the high nonlinearity and low losses of a doped silica glass waveguide for efficient compression.

Main Methods:

  • Fabrication of a 45cm long, high index doped silica glass waveguide.
  • Integration of a nonlinear chirper onto the waveguide.
  • Utilizing CMOS-compatible fabrication processes.
  • Characterization of pulse compression performance at low input peak powers.

Main Results:

  • Demonstration of an optical pulse compressor operating on a sub-picosecond timescale.
  • Achieved pulse compression at relatively low input peak powers.
  • The device is CMOS compatible and utilizes a high-index doped silica glass waveguide.
  • The platform offers flexibility in nonlinearity and dispersion for various compression schemes.

Conclusions:

  • The developed integrated nonlinear chirper is a promising technology for ultra-fast all-optical signal processing.
  • This approach can significantly contribute to meeting future telecommunications bandwidth demands.
  • The CMOS compatibility and waveguide flexibility pave the way for scalable and efficient photonic solutions.