Related Experiment Video
Updated: Jun 10, 2026

Comprehensive Characterization of Extended Defects in Semiconductor Materials by a Scanning Electron Microscope
Published on: May 28, 2016
Using a zone axis for convergent beam electron diffraction measurements of lattice strain in strained silicon
D R Diercks1, M J Kaufman, R B Irwin
1Center for Advanced Research and Technology (CART), University of North Texas, Denton, TX 76207, USA. david.diercks@unt.edu
Abstract:
Convergent beam electron diffraction patterns of silicon from the gate channel region of a complementary metal-oxide-semiconductor transistor with recessed Si(.82)Ge(.18) stressors were analysed using three zone axes: <230>, <340> and <670>. Values measured using these axes were compared with each other with regards to strain along the [110] and the [001] directions. It was demonstrated that strain measurements made using all three axes showed reasonable agreement with each other: an increase in the [110] compressive strain and a switch from compressive to tensile strain in the [001] with decreasing distance below the gate. It was also observed that the strain calculations using the <230> axis had the lowest uncertainty whereas the <670> axis allowed for measurements closest to the gate due to the improved lateral resolution at that tilt angle.
More Related Videos
Related Concept Videos
Measurements of Strain
Three-Dimensional Analysis of Strain
Transformation of Plane Strain
Under plane strain conditions, typical for members where one dimension significantly exceeds the others, deformations and resultant strains are...
Relation between Poisson's ratio, Modulus of Elasticity and Modulus of Rigidity

