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Updated: Jun 10, 2026
Creating Sub-50 Nm Nanofluidic Junctions in PDMS Microfluidic Chip via Self-Assembly Process of Colloidal Particles
Published on: March 13, 2016
Chemical-modification-enhanced dielectrophoretic assembly of controllable and reversible silica submicrowires from
Xiaoxiao He1, Feng Xuan, Kemin Wang
1State Key Laboratory of Chemo/Biosensing and Chemometrics, College of Chemistry & Chemical Engineering, Hunan University, Changsha 410082, China.
Abstract:
In this article, the dielectrophoretic (DEP) assembly of chemically-modified silica nanoparticles (SiNPs) was introduced. Five types of surface-modified SiNPs, including OH-SiNPs, COOH-SiNPs, CH(3)HPO(2)-SiNPs, PEG-SiNPs, and NH(2)-SiNPs, have been investigated. After applying an ac field with relatively high intensity and frequency, it was shown that only COOH-SiNPs and CH(3)HPO(2)-SiNPs could be self-assembled on the microelectrodes by the DEP forces. The results indicated that the anionic group modification could obviously enhance the DEP self-assembly of SiNPs on the microelectrodes. Then the DEP assembly of CH(3)HPO(2)-SiNPs was selected as a representative to be investigated further. By using Rubpy dye doped in the core of the CH(3)HPO(2)-SiNPs, the assembly process was visualized in real time by inverse fluorescence microscopy. Precise control over the frequency of the applied ac field showed that the DEP forces can assemble CH(3)HPO(2)-SiNPs from aqueous suspensions into submicrowires, and it was found that the number of assembled submicrowires between the microelectrode gaps could be well controlled with reversibility. Furthermore, the DEP assembly process of CH(3)HPO(2)-SiNPs was sensitive to the pH of the dispersed medium. These findings would provide a way to circumvent the difficulty in controlling the dielectrophoretic assembly process of nanoparticles and offer application opportunities for the DEP assembly of chemically modified SiNPs.
