[Calculation of dislocation destiny using X-ray diffraction for 4H-SiC homoepitaxial layers]
Ren-xu Jia1, Yu-ming Zhang, Yi-men Zhang
1Key Laboratory of Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi'an 710071, China. rxjia@mail.xidian.edu.cn
Guang Pu Xue Yu Guang Pu Fen Xi = Guang Pu
|September 11, 2010
Summary
This study presents a new method for calculating dislocation density in 4H-SiC layers using X-ray diffraction. It establishes a relationship between dislocation density and FWHM spread, aiding in defect analysis.
Area of Science:
- Materials Science
- Solid State Physics
- Crystallography
Context:
- High dislocation density in 4H-SiC (4H-Silicon Carbide) homoepitaxial layers complicates accurate measurement.
- X-ray diffraction (XRD) is a crucial technique for material characterization, but its accuracy is affected by defect concentrations.
Purpose:
- To develop and validate a theoretical and experimental approach for determining dislocation density in 4H-SiC.
- To establish a quantitative relationship between dislocation density and X-ray diffraction peak broadening (FWHM spread).
- To analyze the origins of dislocations and propose methods for their reduction.
Summary:
- A theoretical model correlates dislocation density with FWHM spread in XRD patterns.
- Experimental XRD data from two crystal faces of 4H-SiC were analyzed to calculate dislocation density.
- The study identifies dislocation origins and suggests strategies for minimizing defect density.
Impact:
- Provides a more reliable method for quantifying dislocations in 4H-SiC, crucial for device performance.
- Offers insights into defect formation mechanisms in SiC epitaxy.
- Contributes to improving the quality and yield of SiC-based electronic devices.
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