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An Available Technique for Preparation of New Cast MnCuNiFeZnAl Alloy with Superior Damping Capacity and High Service Temperature
Published on: September 23, 2018
Zhengzheng Chen1, Nicholas Kioussis, King-Ning Tu
1Department of Physics, California State University, Northridge, California 91330-8268, USA.
Surface tin (Sn) alloying on copper (Cu) hinders copper adatom movement. Tin atoms create barriers and reduce mobility, acting as blocking sites that inhibit diffusion on the Cu-Sn (111) alloy surface.
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