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Related Experiment Video

Updated: Jun 8, 2026

Evaluating Targeting Accuracy in the Focal Plane for an Ultrasound-guided High-intensity Focused Ultrasound Phased-array System

Evaluating Targeting Accuracy in the Focal Plane for an Ultrasound-guided High-intensity Focused Ultrasound Phased-array System

Published on: March 6, 2019

A matching pursuit method for approximating overlapping ultrasonic echoes.

Etai Mor¹, Amnon Azoulay, Mayer Aladjem

¹Department of Non Destructive Testing, Soreq Nuclear Research Center, Yavne, Israel.

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control

|September 30, 2010

Summary

Ultrasonic pulse-echo methods struggle with thin layers due to overlapping echoes. A new Support Matching Pursuit (SMP) method accurately resolves individual echoes for improved thickness measurements.

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Area of Science:

Materials Science
Acoustics
Signal Processing

Background:

Ultrasonic pulse-echo techniques are vital for measuring layered structures and adhesive interfaces.
Conventional methods face limitations in resolving thin layers due to overlapping echoes from successive interfaces.
Accurate thickness measurement of thin adhesive layers is crucial for structural integrity.

Purpose of the Study:

To introduce a novel signal processing method, Support Matching Pursuit (SMP), for resolving individual ultrasonic echoes.
To overcome the limitations of conventional pulse-echo techniques in measuring thin layered structures.
To enable accurate characterization of thin adhesive interface layers.

Main Methods:

Developed Support Matching Pursuit (SMP), a sparse signal approximation method using an overcomplete dictionary of Gabor atoms.
Implemented an atom selection criterion that leverages the time-localization of ultrasonic echoes.
Compared the performance of SMP against traditional sparse approximation methods like Matching Pursuit (MP) and Basis Pursuit (BP).

Main Results:

SMP accurately resolves individual ultrasonic echoes, even when they overlap in time.
The method provides physically interpretable approximations, with each echo represented by a single atom.
Simulations and experiments on adhesively bonded structures demonstrated SMP's superior performance over MP and BP.

Conclusions:

Support Matching Pursuit (SMP) significantly enhances the capability of ultrasonic pulse-echo methods for measuring thin layers.
SMP offers a robust solution for resolving overlapping echoes, improving accuracy in thickness measurements of adhesive interfaces.
This method holds promise for non-destructive evaluation of layered materials and structures.