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Design and Development of a Three-Dimensionally Printed Microscope Mask Alignment Adapter for the Fabrication of Multilayer Microfluidic Devices
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Advanced mask aligner lithography: new illumination system.

Reinhard Voelkel1, Uwe Vogler, Andreas Bich

  • 1SUSS MicroOptics SA, Jaquet-Droz 7, 2000 Neuchâtel, Switzerland. voelkel@suss.ch

Optics Express
|October 14, 2010
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Summary
This summary is machine-generated.

A novel illumination system for mask aligner lithography offers superior light uniformity and spectral control. This advancement enables advanced resolution enhancement technologies (RET) for improved lithography processes.

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Area of Science:

  • Optics and Photonics
  • Semiconductor Manufacturing
  • Micro/Nano Fabrication

Background:

  • Mask aligner lithography is crucial for semiconductor device fabrication.
  • Existing illumination systems face challenges in uniformity and spectral control.
  • Advanced resolution enhancement technologies (RET) are needed for next-generation lithography.

Purpose of the Study:

  • To present a new illumination system for mask aligner lithography.
  • To achieve excellent uniformity in light irradiance and angular spectrum.
  • To enable the integration of RET in mask aligner lithography.

Main Methods:

  • Utilized two sequential microlens-based Köhler integrators.
  • Positioned the second Köhler integrator in the Fourier plane of the first.
  • Employed spatial filtering for angular spectrum shaping.

Main Results:

  • Achieved uncoupled illumination, separating light from the source.
  • Demonstrated excellent uniformity of light irradiance and angular spectrum.
  • Enabled free shaping of the angular spectrum to minimize diffraction.

Conclusions:

  • The new system provides precise control over illumination light.
  • Facilitates the implementation of customized illumination, optical proximity correction (OPC), and source-mask optimization (SMO).
  • Enhances mask aligner lithography capabilities for advanced semiconductor manufacturing.