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Multimodal Nonlinear Hyperspectral Chemical Imaging Using Line-Scanning Vibrational Sum-Frequency Generation Microscopy

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High resolution line scan interferometer for solder ball inspection using a visible supercontinuum source.

Malay Kumar¹, Mohammed N Islam, Fred L Terry

¹Department of Electrical Engineering and Computer Science, University of Michigan, 1301 Beal Avenue, Ann Arbor, Michigan 48109, USA. malayk@umich.edu

|October 14, 2010

Summary

This summary is machine-generated.

A novel line scan interferometer provides high-resolution 3D imaging of semiconductor solder balls. This technology accurately measures solder ball height and detects shape defects on curved surfaces.

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Area of Science:

Optical metrology
Semiconductor manufacturing
Surface characterization

Background:

Accurate 3D characterization of solder balls is crucial for semiconductor packaging quality.
Existing methods may struggle with curved surfaces and defect detection.

Purpose of the Study:

To develop and demonstrate a line scan interferometer for high-resolution 3D imaging of solder balls.
To assess the system's capability in measuring solder ball height and detecting shape defects on curved surfaces.

Main Methods:

Utilized a visible supercontinuum source coupled to a Fourier domain Michelson interferometer.
Acquired 3D images of solder balls (~300 μm height) on semiconductor dies.
Investigated the influence of surface roughness on measurable angular tilt.

Main Results:

Achieved 125 nm axial and 15 μm lateral resolution for solder ball imaging.
Successfully measured solder ball height and identified shape defects on curved surfaces.
Demonstrated height measurement up to +/-20 degrees from the surface normal on solder balls and +/-60 degrees on a rough steel ball bearing.

Conclusions:

The line scan interferometer enables precise 3D metrology of solder balls, including defect analysis.
The system's performance is influenced by surface roughness, affecting the measurable angular range.
This technique offers a valuable tool for quality control in semiconductor packaging.