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Design considerations and algorithms for partitioning optoelectronic multichip modules.

J Fan, B Catanzaro, V H Ozguz

    Applied Optics
    |November 6, 2010
    PubMed
    Summary
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    This study presents a computer-aided design approach for partitioning optoelectronic systems into multichip modules (MCMs). Algorithms optimize interconnects, minimizing power dissipation and improving system packaging performance.

    Area of Science:

    • Electrical Engineering
    • Computer Engineering
    • Optoelectronics

    Background:

    • Optical interconnects are crucial for enhancing multichip module (MCM) performance.
    • Effective integration of optical and electronic technologies necessitates a robust system partitioning methodology.
    • Determining the optimal technology (optical or electronic) for each interconnect is a key design challenge.

    Purpose of the Study:

    • To introduce a computer-aided design (CAD) approach for partitioning optoelectronic systems into optoelectronic MCMs.
    • To address the critical design trade-offs in optoelectronic systems, including speed, power, area, and optical limits.
    • To develop and present new algorithms for optimizing optoelectronic MCM partitioning.

    Main Methods:

    • Discussion of design trade-offs: speed, power dissipation, area, and diffraction limits for free-space optics.

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  • Formulation of a partitioning problem for optoelectronic MCMs.
  • Development of novel algorithms focused on minimizing power dissipation during partitioning.

    • Main Results:

    • The proposed algorithms demonstrate improvements in system packaging.
    • The effectiveness of the partitioning algorithms was validated using a multistage interconnect network example.
    • Variable chip configurations (number and size) were analyzed, showing consistent packaging enhancements.

    Conclusions:

    • The developed CAD approach and optimization algorithms effectively partition optoelectronic systems.
    • Minimizing power dissipation is a key factor in optimizing optoelectronic MCM design.
    • The methodology offers a pathway to improved performance and packaging in optoelectronic MCMs.